| PART |
Description |
Maker |
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| AS4C64M16D3A-12BIN AS4C64M16D3A-12BCN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| ECG2331 ECG2326 ECG2322 ECG2328 ECG2332 ECG2333 |
FAN AC 176X89 220V BALL, 420cfm
TRANSISTOR | BJT | DARLINGTON | NPN | 100V V(BR)CEO | 8A I(C) | TO-220VAR
FAN AC 172X51 115V BALL, 106cfm
TRANSISTOR | BJT | NPN | 200V V(BR)CEO | 15A I(C) | TO-247VAR 晶体管|晶体管| npn型| 200伏五（巴西）总裁|5A一（c）|47VAR
FAN AC 180X65 115V BALL, 400cfm 晶体管|晶体管|达林顿|叩| 60V的五（巴西）总裁|甲一（c）|20
FAN AC 180X65 115V BALL, 340cfm 晶体管|晶体管|叩| 450V五（巴西）总裁| 8A条一c）| TO - 220AB现有
|
Vishay Intertechnology, Inc.
NEC, Corp.
|
| M6MGB64BM34CWG-P M6MGT64BM34CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM17AWG-P M6MGT64BM17AWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| CM1426-04CP CM1426-06CP CM1426-08CP |
LCD and Camera EMI Filter Array with ESD Protection
6 FUNCTIONS, DATA LINE FILTER ROHS COMPLIANT, CSP-15
|
ON Semiconductor
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| FCRN303 FCRN3031003FA |
Percision thin film resistor CSP
0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|
